UNICOMP · Benchtop
CX3000
90 kV · 5 µm focal spot.
Source: Unicomp CX3000 datasheet.
Inspection
SPI, AOI and X-ray: solder paste, components and solder joints, by technology.
20 machines
New
MAKER RAY
Dual-inspection AOI
Both sides of the board, inspected at once.
It programs itself: it finds the parts, draws their windows (body, silkscreen, leads and solder joints) and assigns their algorithm and parameters. Source: Maker Ray AIS50X-HW brochure, p. 1 (“Programming Method”).
View the AIS50X-HW
SPI
1 machine
AI programming
AI programming, with or without a Gerber file: it draws the inspection windows by itself.
Board
AIS631M-HW: 50 × 50 – 510 × 460 mm (large board mode: 710 × 460 mm) · AIS631M-D-HW: single lane, 50 × 50 – 510 × 610 mm; dual lane, 50 × 50 – 510 × 330 mm each (minimum 55 mm between lanes) · AIS631MB-HW: 50 × 50 – 510 × 460 mm (large board mode: 710 × 460 mm) · AIS631MB-D-HW: single lane, 50 × 50 – 510 × 610 mm; dual lane, 50 × 50 – 510 × 330 mm each (minimum 55 mm between lanes)
Resolution and field of view
AIS631M-HW: 10 µm, 40 × 30 mm; 15 µm, 60 × 45 mm (optional) · AIS631M-D-HW: 10 µm, 40 × 30 mm; 15 µm, 60 × 45 mm (optional) · AIS631MB-HW: 15 µm, 36 × 30 mm; 10 µm, 24 × 20 mm (optional) · AIS631MB-D-HW: 15 µm, 36 × 30 mm; 10 µm, 24 × 20 mm (optional)
Inspection speed
0.28 s / FOV
Component height
Top: 25 mm / Bottom: 40 mm
Where it says so
Maker Ray AIS 63X-HW brochure, pp. 1 and 2 (“Programming Method”, “AI intelligent programming”); manufacturer’s datasheet (Maker Ray).
Pre-reflow 2D AOI
1 machine
Board
measurable · AIS401B-HW50 × 50 mm – 510 × 460 mm (large board: 50 × 50 mm – 690 × 460 mm (custom))measurable · 401B-D-HWSingle lane: 50 × 50 mm – 510 × 610 mm (large board mode supports 690 × 610 mm) Dual lane: 50 × 50 mm – 510 × 330 mm (large board mode supports 690 × 330 mm) (The minimum distance between the two middle tracks is 55 mm)
Camera
AIS401B-HW12 MP color high speed camera.401B-D-HW12 MP color high speed camera
Resolution
AIS401B-HW10 µm401B-D-HW10 µm
Inspection speed
inspection · AIS401B-HW0.23 s/FOVinspection · 401B-D-HW0.23 s/FOV
Where it says so
Manufacturer’s datasheet (Maker Ray).
AOI 3D
1 machine
AI programming
It programs itself: it finds the parts, draws their windows (body, silkscreen, leads and solder joints) and assigns their algorithm and parameters.
Board
Single lane: 50 × 50 – 510 × 610 mm (large board mode: up to 710 × 610 mm) Dual lane: 50 × 50 – 510 × 330 mm (large board mode: up to 710 × 330 mm)
Camera
1 high-speed industrial 21 MP main camera + 4 side cameras
Resolution
13 µm: 66 × 53 mm 10 µm: 51 × 40 mm
Inspection speed
Up to 0.5 s / FOV
Where it says so
Maker Ray AIS 43X-HW brochure, p. 1 (“Programming Method”); manufacturer’s datasheet (Maker Ray).
Dual-inspection AOI
4 machines
Compare
AI programming
It programs itself: it finds the parts, draws their windows (body, silkscreen, leads and solder joints) and assigns their algorithm and parameters.
One-click AI programming: it draws the windows of trained parts by itself and, when analyzing defects, sets up the algorithm and its parameters.
—
One-click AI programming: it draws the windows of trained parts by itself and, when analyzing defects, sets up the algorithm and its parameters.
Board
50 × 50 – 510 × 460 mm, belt or chain (AIS501B-HW; large board mode 730 × 460 mm, optional) / 50 × 50 – 510 × 650 mm (AIS501B-L-HW; large board customization up to 730 × 650 mm)
50 × 50 mm – 510 × 510 mm (Modo placa grande support 710 × 510 mm, option)
—
50 × 50 mm – 510 × 510 mm (Modo placa grande support 710 × 510 mm, option)
Camera
Top & bottom: 12 MP color high speed camera
Top, 2D12 MP color high speed cameraBottom, 3D12 MP high frame rate monochrome industrial camera
—
Top & Bottom: 12 MP high frame rate monochrome industrial camera
Resolution
15 µm @ 60 × 45 mm & 10 µm @ 40 × 30 mm (option)
and field of view · Top, 2D15.5 µm@65 × 43 mm & 10 µm@40 × 30 mm (Option)and field of view · Bottom, 3D15 µm@60 × 45 mm & 10 µm@40 × 30 mm (Option)
—
Top & Bottom: 15 µm@60 × 45 mm & 10 µm@40 × 30 mm (Option)
Inspection speed
0.23 s/FOV
Top, 2D0.26 s/FOVBottom, 3D0.58 s/FOV
—
Top & Bottom: 0.65 s/FOV
Component height
Top: 75 mm, Bottom: 50 mm (can be adjusted to 75 mm)
Top: 75 mm, Bottom: 30 mm
—
Top: 35 mm, Bottom: 35 mm
Where it says so
Maker Ray AIS50X-HW brochure, p. 1 (“Programming Method”); manufacturer’s datasheet (Maker Ray).
Manufacturer’s datasheet (Maker Ray).
—
Manufacturer’s datasheet (Maker Ray).
X-ray
13 machines
Where do you inspect?
3D renderings
UNICOMP · Offline
AX7900
90 kV · up to 52×.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX8200MAX
100 kV · 60° tilt.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX8300
110 kV · 49.8× geometric.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX8300MAX
5 µm microfocus.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX8500
110 kV · 1,000×.
- 5µmResolution
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX9100
130 kV · 41× geometric.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX9100MAX
130 kV · 360° stage.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX9180
180 kV · 360° stage.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX9100vs
2D, 2.5D and 3D · ≤ 2 µm.
Source: Unicomp AX series datasheets.
UNICOMP · Offline
AX9500
3D · ≤ 1 µm · 2,500×.
Source: Unicomp AX series datasheets.
UNICOMP · Inline
LX2000
Inspection area up to 600 × 500 mm.
- 0.4sPer field of view
Source: official Unicomp brochure (LX2000, 2025).
UNICOMP · Inline
LX9200 VISION SERIES
2D, 2.5D and 3D · 9–30 µm.
Source: Unicomp LX2000 and LX9200 datasheets.
Compare
Focal spot size
5 µm
5 µm
5 µm
5 µm
—
5 µm
≤ 7 µm
≤ 7 µm
—
—
—
5 µm (90 kV) · 7 µm (130 kV)
—
Tube voltage
—
90 kV
100 kV
max. kV / type110 kV (90 kV option) / sealed
—
—
130 kV
130 kV
—
130 kV (closed tube)
Up to 160 kV (open tube)
Up to 130 kV (90 or 130 kV tube)
Up to 130 kV (options available)
Magnification
200X
52X (under specific conditions)
600X
49.8X (under specific conditions)
—
1000X
41X (under specific conditions)
1600X
—
1200X (6000X synthesized)
2500X (7500X synthesized)
200X
—
Inspection area
250 × 330 mm
505 × 440 mm
550 × 520 mm
—
—
450 × 450 mm
565 × 510 mm
450 × 600 mm
—
in 2D and 2.5D500 × 500 mmin 3DPlanar 3D: 400 × 400 mm · Cone-beam 3D: 80 × 200 mm (D × H)
Planar 3D: 470 × 500 mm · Cone-beam 3D: 100 × 200 mm
600 × 500 mm (without the integrated reading and marking mechanism)
—
Detector
Flat panel detector (FPD)
Flat panel detector (FPD)
Flat panel detector (FPD)
—
High-resolution FPD
Flat panel detector (FPD)
Flat panel detector (FPD)
Flat panel detector (FPD)
—
Flat panel, high definition
Flat panel, high definition
Flat panel detector (FPD)
—
Where it says so
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
—
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Manufacturer’s datasheet (UNICOMP).
Already know which machine you’re looking for?
Search by model or by brand. Or tell us about your board and we’ll tell you what you need.